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Epoxy potting compound ER2183RP250G, 250 g packing

(Product No.: ER2183RP250G)

Epoxy potting compound ER2183RP250G, 250 g packing

ArticleNo: ER2183RP250G

Epoxy potting compound ER2183RP250G, 250 g packing

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Epoxy potting compound ER2183RP250G, 250 g packing

The Electrolube ER2183RP250G epoxy encapsulant is a high-quality solution for encapsulating and sealing electronic components. This product is characterized by its thermal conductivity and low viscosity, making it ideal for applications involving small electronic assemblies and narrow gaps requiring efficient heat dissipation. The compound is easy to mix as it uses no abrasive fillers, and covers a wide operating temperature range from -40°C to +130°C.
The specific thermal conductivity is 1.25 W/m*K. Additionally, this product meets the UL94-V0 requirements, which means it exhibits a relatively low level of toxic gases and smoke release in the event of a fire and is RoHS compliant. The epoxy encapsulant is available in a 250 g package, which is bagged, and has a shelf life of 18 months. The packaging unit includes 10 pieces. With its black color and excellent adhesive properties, this product provides a reliable solution for various encapsulation tasks.