Solders and soldering agents

Solders are materials used in electronics manufacturing to connect electronic components. There are different types of solders that are selected depending on the application and materials, such as lead-free solders or solders with a low melting point for sensitive components.
The image shows several metallic rods of varying lengths, some are straight, others are slightly bent. They are stacked in two groups. The surface appears to be shiny.
FELDER Solder bar Sn100C
Melting point: 227 °C / Form: Bars / Weight : approx. 1000g g
Electronics solder Felder "SN100C"
Sn99,3CuNiGe0,0055
melting point 227°C
according to NIHON-SUPERIOR-Pat.No. EP 0985486B1
bars, ca. 1000g, 330 x 20 x 20 mm

Product No.: FE-5612940040
Price on request
The image shows several metallic rods of varying lengths, some are straight, others are slightly bent. They are stacked in two groups. The surface appears to be shiny.
FELDER solder bars Sn63Pb37
Melting point: 183 °C / Form: Triangular bars / Weight : approx. 250 g
FELDER electronics solder ISO-Tin S Sn63Pb37E
DIN EN 61190
Triangular bars, approx. 250 g

Product No.: FE-12780120
Price on request
The image shows a round coil made of black plastic, with shiny, thin wire windings on it. The coil has a flat top with a grid pattern.
Solder wire massive
Form: Reel / Weight : 1000 g

Product No.: FE-14843040
Price on request
The image shows a round coil made of black plastic, with shiny, thin wire windings on it. The coil has a flat top with a grid pattern.
Solder wire massive
Form: Reel / Weight : 1000 g
Solder wire "Solid", Sn63Pb37
DIN EN 29453
3.00 mm diameter, 1.0 kg reel

Product No.: FE-14753040
Price on request
Image
Solder paste ISO-Cream EL3202 500g
Content : 500 g / Metal content [%]: 90 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "EL-3202" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can
(EN 61190-ROL1)

Product No.: FE-238432029060
Price on request
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Solder paste ISO-Cream EL5510 500g
Content : 500 g / Metal content [%]: 88 - 89 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "EL 5510" S Sn96Ag +
(Sn96.5Ag3.0Cu0.5NiGe), flux DIN EN 29454
1.1.3.C (EN61190 ROL0)
Metal powder content 88-89%, particle size 3
500 g can

Product No.: FE-55237655118960
Price on request
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Solder paste ISO-Cream EWL 250g
Content : 250 g / Metal content [%]: 89 % / Grain size: 3 (25-45 µm)
Solder paste ISO-Cream "ELW-2303" Sn95.5Ag4Cu0.5
Lead-free, flux DIN EN 29454, 2.1.3.C
Metal powder content 89%, particle size 3
melting point 217° C eutectic, 250 g can

Product No.: FE-238423038955
Price on request
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