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Epoxy potting compound ER2218RP250G, 250 g packing

(Product No.: ER2218RP250G)

Epoxy potting compound ER2218RP250G, 250 g packing

Name: Epoxy potting compound ER2218RP250G, 250 g packing
SKU: ER2218RP250G
Price: 25.55 EUR
Availability: InStock

ArticleNo: ER2218RP250G

Epoxy potting compound ER2218RP250G, 250 g packing

dpvlink:

2819

Properties:

Note:

- only complete packaging units (PU) available -

Further product information

Minimum order:

10 PCE

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25,55 EUR

excl. 19% tax

10 PCE

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Product Info

Epoxy potting compound ER2218RP250G, 250 g packing

The Electrolube ER2218 epoxy encapsulation compound, packaged in 250 g, is an advanced low-viscosity epoxy casting resin specifically developed for encapsulating and sealing electronic components. Its formulation allows for effective protection of even the most complex and smallest electronic assemblies, particularly in applications exposed to extreme or fluctuating temperatures, such as during the reflow soldering process.
The resin system is characterized by exceptional thermal stability and a flame-retardant property that meets UL94-V0 standards. Additionally, it is RoHS compliant and offers excellent resistance to mechanical stresses and chemicals such as solvents. Due to its low viscosity, the encapsulation compound is ideally suited for components with very tight clearances.
The curing agent used is free from DDM or other aromatic amines, which minimizes the release of toxic gases and smoke during the curing process. This makes ER2218 an environmentally friendly and safe choice for various electronic applications.