Silicone-Based Thermal Compound HTS01K
The silicone-based thermal compound HTS01K is a high-performance product specifically developed for efficient heat dissipation between electronic components or surfaces. This thermal paste is based on a silicone oil enriched with metal oxides and offers outstanding thermal connectivity.
Technical Specifications:
- Thermal conductivity: 0.90 W/mK
- Operating temperature range: -50 °C to +200 °C
- Excellent anti-creep properties
- Vibration stable, ideal for gap filling applications
- Low weight loss due to evaporation
- Low toxicity and economical consumption
The paste is economical in use and is characterized by its durability and efficiency. It is available in bulk containers of 1 kg, with only complete packaging units of 4 pieces available. It is packaged in practical containers, which facilitate handling and storage.
Details
- Packaging type
Packaging type
- container
- Large container
Large container
- 1 kg
- PU
PU
- 4 piece
- Shelf life
Shelf life
- 3 years
- only complete packaging units (PU) available -