Silicone-based Thermal Paste HTS35SL
The silicone-based thermal paste HTS35SL provides efficient heat conduction thanks to its composition of silicone oil filled with metal oxides. This paste is ideal for applications where a reliable thermal connection between electronic components or surfaces is required. It features excellent anti-creep properties and stability against vibrations, making it particularly suitable for gap-filling applications.
Technical Data:
- Thermal conductivity: 0.90 W/mK
- Operating temperature range: -50 °C to +200 °C
- Low toxicity and economical consumption
- Low weight loss due to evaporation
The paste is only available in complete packaging units of 10 pieces in a 35 ml syringe and has a shelf life of 3 years. Ideal for cost-effective and straightforward applications in the electronics industry.
Details
- Packaging type
Packaging type
- syringe
- PU
PU
- 10 piece
- Shelf life
Shelf life
- 3 years
- Volume
Volume
- 35 ml
- only complete packaging units (PU) available -