Silicone-free thermally conductive paste HTC35SL 35 ml
Silicone-Free Thermal Paste HTC35SL
The silicone-free thermal paste HTC35SL is specifically designed for applications that require an efficient and reliable thermal connection between electronic components or surfaces to dissipate heat. This paste is ideal for application on the base and mounting bolts of diodes, transistors, thyristors, on heat sinks, silicone rectifiers, semiconductors, thermostats, power resistors, and coolers.
Technical Specifications:
- Anti-creep properties
- Thermal conductivity: 0.9 W/mK
- Operating temperature range: -50 °C to +130 °C
- Low weight loss due to volatilization
- Easy to apply
- Low toxicity
The paste is only available in complete packaging units, with a shelf life of 3 years when properly stored. The packaging type is a syringe with a volume of 35 ml.
The silicone-free thermal paste HTC35SL is specifically designed for applications that require an efficient and reliable thermal connection between electronic components or surfaces to dissipate heat. This paste is ideal for application on the base and mounting bolts of diodes, transistors, thyristors, on heat sinks, silicone rectifiers, semiconductors, thermostats, power resistors, and coolers.
Technical Specifications:
- Anti-creep properties
- Thermal conductivity: 0.9 W/mK
- Operating temperature range: -50 °C to +130 °C
- Low weight loss due to volatilization
- Easy to apply
- Low toxicity
The paste is only available in complete packaging units, with a shelf life of 3 years when properly stored. The packaging type is a syringe with a volume of 35 ml.
Details
- Packaging type Packaging type
- syringe
- PU PU
- 1 piece
- Shelf life Shelf life
- 3 years , when stored properly
- Volume Volume
- 35 ml
GHS09
Substances and mixtures that acutely or chronically endanger water bodies and thus the environment
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Packaging type
PU
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Volume
Large container
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