Silicone-Free Thermal Paste HTCX35SL
The silicone-free thermal paste HTCX35SL is distinguished by its excellent anti-creep properties and a very low weight loss due to the volatilization of the carrier oil used. The product is easy and economical to use and offers a thermal conductivity of 1.35 W/mK. The paste is particularly suitable for technical applications where silicone must be avoided.
Technical Data:
- Thermal conductivity: 1.35 W/mK
- Shelf life: 4 years with proper storage
- Packaging unit (PU): 10 pieces
- Type of packaging: Syringe
- Volume: 35 ml
This product is ideal for applications in areas such as thermal conductive rubber, thermal conductive adhesive, and other thermal conductive products, where efficient heat dissipation without the use of silicone is required.
Details
- Packaging type
Packaging type
- syringe
- PU
PU
- 10 piece
- Shelf life
Shelf life
- 4 years , when stored properly
- Volume
Volume
- 35 ml