Silicone-Free Thermal Paste HTCX700G
The silicone-free thermal paste HTCX700G is distinguished by its excellent anti-creep properties and very low weight loss due to the volatilization of the carrier oil used. It offers a simple and economical application. This paste is particularly effective with a thermal conductivity of 1.35 W/mK and ensures reliable heat transfer in various technical applications.
Technical Specifications:
- Shelf Life: 6 years
- Content: 700 g
- Packaging Unit (PU): 1 piece
- Type of Packaging: Cartridge
Part Number: HTCX700G
The thermal paste is ideal for applications where silicone-free solutions are required and supports efficient heat dissipation in electronic devices and other high-tech components.
Details
- Packaging type
Packaging type
- cartridge
- Content [g]
Content [g]
- 700 g
- PU
PU
- 1 piece
- Shelf life
Shelf life
- 6 years