PE foam, dissipative 340x255x3 mm

Name: PE foam, dissipative 340x255x3 mm
SKU: 4550.03.0255.KLT
Price: 1.50 EUR
Availability: InStock

ArticleNo: 4550.03.0255.KLT

dpvlink:

700

Length [mm]:

340 mm

Width [mm]:

255 mm

Thickness [mm]:

3 mm

Properties:

Further product information

Availability: at short notice

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1,50 EUR

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Product Info

The offered PE foam, precisely sized at 340x255x3 mm, is specifically designed for use in KLT containers of size 400x300 mm. This foam is characterized by its electrostatic discharge capability and meets the requirements of the ESD standard DIN EN 61340-5-1, making it ideal for use in ESD-sensitive environments.
The material consists of cross-linked, closed-cell polyethylene, which is corrosion-free and abrasion-resistant. With a material density of 46 kg/cm³ and a maximum operating temperature of 90 °C, it offers a reliable and durable solution. The typical surface resistance varies between 10^5 and 10^7 Ω, with the skin side ranging from 10^5 to 10^6 Ω and the non-skin side ranging from 10^7 to 10^8 Ω.
These properties make the foam versatile for use, for example, as insert foam, an interlayer or partition wall for containers, as well as a workstation underlay, always ensuring ESD safety.

Details

Length [mm] Length [mm]: 340 mm
Width [mm] Width [mm]: 255 mm
Thickness [mm] Thickness [mm]: 3 mm
Color Color: black
Conductivity Conductivity: dissipative
Volume resistance Volume resistance: 10⁵ - 10⁷ Ω
Material Material: polyethylene
Material density Material density: 46 kg/cm³
Operating temperature Operating temperature: 90 °C

Pictograms

Material PE

Abrasion-resistant and corrosion-free, particularly low weight, thickness 3 mm / 6 mm / 10 mm, electrostatically dissipative (suitable as intermediate layers and compartments for containers). Typical surface resistance: R = 10^5 –10^8 Ohm.

ESD-compliant

Customizable

Interlayers and compartments can be individually adapted to your wishes and requirements. Size and shape can be adapted. Solutions with cut-outs are also possible.

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