CORTRONIC shipping box E-Prom 120x100x15mm with pin-insertion and napped foam
The CORTRONIC shipping box E-Prom, manufactured by Kolb, offers an optimal solution for the secure and protected shipping of sensitive electronic components. With an inner dimension of 120x100x15mm and an outer length of 124mm, width of 104mm, and height of 22mm, this box is specifically designed for small-sized items.
The box is equipped with a 6 mm thick PE insert foam and a 10 mm thick nubbed foam, both of which are electrically conductive and have a surface resistance of 10^7 to 10^8 Ohm. These features guarantee high shielding properties according to the standards DIN EN 61340-5-1 and IEC, enabling the safe transport of electrostatically sensitive products.
The box is distinguished by a durable blue color, adorned with an ESD warning print, the type designation, and a recycling symbol, which underscores compliance with environmental standards. Please note that the minimum order quantity is 10 pieces.
The box is equipped with a 6 mm thick PE insert foam and a 10 mm thick nubbed foam, both of which are electrically conductive and have a surface resistance of 10^7 to 10^8 Ohm. These features guarantee high shielding properties according to the standards DIN EN 61340-5-1 and IEC, enabling the safe transport of electrostatically sensitive products.
The box is distinguished by a durable blue color, adorned with an ESD warning print, the type designation, and a recycling symbol, which underscores compliance with environmental standards. Please note that the minimum order quantity is 10 pieces.
Details
- Foam Foam
- PE foam for pin insertion / napped foam
- Color Color
- blue
- Height [mm] Height [mm]
- 22
- Internal height
- 15
- Internal length
- 120
- Internal width Internal width
- 100
- Length [mm] Length [mm]
- 124
- Width [mm] Width [mm]
- 104
- Conductivity foam Conductivity foam
- conductive
- Surface resistance Rs Surface resistance Rs
- 107 - 108 Ω
ESD protective
Electrostatic Discharge - marking for materials intended to protect other components from ESD by avoiding potential differences.
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