Solder paste ISO-Cream "Clear"
Solder Paste ISO-Cream "Clear"
ISO-Cream® "Clear" SMD solder paste from Felder is a high-quality, lead-free solder paste specifically designed for wetting on circuit board surfaces such as NiAu and NiPd. It can be used in both normal and protective gas atmospheres, as well as in vapor phase. The paste is halogen-free (<0.01%) and rosin-free, resulting in clear and inconspicuous residues. Additionally, it shows a low tendency for void formation. The solder paste offers excellent contour stability and optimal printing properties with a very high surface resistance. It is suitable for all reflow applications and has a long processing time of at least 48 hours. Technical Data: - Item number: FE-238552008960 - Content: 500 g - Metal content: 88.5% - Grain size: 3 (25-45 µm) - Melting point: 217 - 219 °C eutectic - Alloy: Sn95.5Ag4Cu0.5 - Viscosity: Adjustable between 300 and 900 Pa s (according to Brookfield, 5 rpm, TF spindle, 25 °C) upon customer request ISO-Cream® "Clear" guarantees 100% continuous, batch-overlapping quality through state-of-the-art testing and control procedures. Ideal for technical buyers who value precision and reliability.
ISO-Cream® "Clear" SMD solder paste from Felder is a high-quality, lead-free solder paste specifically designed for wetting on circuit board surfaces such as NiAu and NiPd. It can be used in both normal and protective gas atmospheres, as well as in vapor phase. The paste is halogen-free (<0.01%) and rosin-free, resulting in clear and inconspicuous residues. Additionally, it shows a low tendency for void formation. The solder paste offers excellent contour stability and optimal printing properties with a very high surface resistance. It is suitable for all reflow applications and has a long processing time of at least 48 hours. Technical Data: - Item number: FE-238552008960 - Content: 500 g - Metal content: 88.5% - Grain size: 3 (25-45 µm) - Melting point: 217 - 219 °C eutectic - Alloy: Sn95.5Ag4Cu0.5 - Viscosity: Adjustable between 300 and 900 Pa s (according to Brookfield, 5 rpm, TF spindle, 25 °C) upon customer request ISO-Cream® "Clear" guarantees 100% continuous, batch-overlapping quality through state-of-the-art testing and control procedures. Ideal for technical buyers who value precision and reliability.
Details
- Content [g] Content
- 500
- Metal content [%] Metal content [%]
- 88.5
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217 - 219
No-clean SMD soft solder pastes
| Homogeneous, ready-made and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "EL 5510" | No-clean SMD solder paste, best wetting in lead-free applications. Premium contour stability, optimal printability, very high surface resistance. Long processing period of at least 48 hours. Suitable for all reflow applications. (ROL0) |
| ISO-Cream® "Clear" | No-clean SMD solder paste, best wedding on all PCB surfaces especially NiAu and NiPd unter normal conditions. Ptotective atmosphere also in the vapor phase, halogene-fre (<0.01%), rosin-free, clear and unobtrusive residues, low tendency to void generation |
| ISO-Cream® "EL 3202" | No-clean SMD solder paste, best suitability for vapor phase soldering. Particularly suited for the stencil printing. Low water-clear residues. Long processing period of at least 48 hours. (ROL1) |
| ISO-Cream® "EL 3203" | No-clean SMD solder paste with excellent wet bonding strength for automatic placement machines with high acceleration or deceleration. Printed circuit boards up to 32 h can be equipped. High contour stability, high service life on the stencil (up to 8 hours). (ROL1) |
SMD special soft soldering pastes
For soldering of poorly solderable components with downstream cleaning process. Homogeneous, ready to use and low-odor mixture of metal powder, binders, solvents, fluxes and thixotropics. | |
| ISO-Cream® "RA 2601" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ROM1. Especially for poorly wettable solder partner. The flux residues on the soldered circuits should be removed. |
| ISO-Cream® "ELW 2303" | Flux according to DIN EN 29454.1, 1.1.3.C or DIN EN 61190-1-3, ORM0. Solder paste with water soluble residues. Excellent wetting on all common surfaces. The residues can be completely removed with distilled water. |
| Cans | 250 g und 500 g |
| Cartridges | 6 und 12 oz Semco® |
| Cartridges | ProFlow™ and PuckPack™ |
| Dispenser cartridge | 5, 10 und 30 ccm |
 Alloys | |
| Sn96Ag+® Sn96.5Ag3Cu0.5NiGe | 217 - 219 ºC |
| Sn100Ni+® Sn99.3Cu0.7AgNiGe | 227 ºC eutectic |
| Sn95.5Ag4Cu0.5 | 217 ºC eutectic |
| Sn96.5Ag3.5 | 221 ºC eutectic |
| Bi58Sn42 | 138 ºC eutectic |
| Leaded Alloys | |
| Sn62Pb36Ag2 | 179 ºC eutectic |
| Sn63Pb37 | 183 ºC eutectic |
| Pb93Sn5Ag2 | 296 - 301 ºC |
| Metal proportions | |
| Dispenser application | 85 - 88 % |
| Screen printing | 88 % |
| Stencil printing | 88 - 90 % |
| Grain sizes | ||
| KG 2 | Standard | 45 - 75 µm |
| KG 3 | Fine-Pitch | 25 - 45 µm |
| KG 4 | Superfine-Pitch | 20 - 38 µm |
| KG 5 | Superfine-Pitch | 15 - 25 µm |
GHS05
Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)
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