Solder Paste ISO-Cream "Clear"
ISO-Cream® "Clear" SMD solder paste from Felder is a high-quality, lead-free solder paste specifically designed for wetting on circuit board surfaces such as NiAu and NiPd. It can be used in both normal and protective gas atmospheres, as well as in vapor phase. The paste is halogen-free (<0.01%) and rosin-free, resulting in clear and inconspicuous residues. Additionally, it shows a low tendency for void formation. The solder paste offers excellent contour stability and optimal printing properties with a very high surface resistance. It is suitable for all reflow applications and has a long processing time of at least 48 hours.
Technical Data:
- Item number: FE-238552008960
- Content: 500 g
- Metal content: 88.5%
- Grain size: 3 (25-45 µm)
- Melting point: 217 - 219 °C eutectic
- Alloy: Sn95.5Ag4Cu0.5
- Viscosity: Adjustable between 300 and 900 Pa s (according to Brookfield, 5 rpm, TF spindle, 25 °C) upon customer request
ISO-Cream® "Clear" guarantees 100% continuous, batch-overlapping quality through state-of-the-art testing and control procedures. Ideal for technical buyers who value precision and reliability.
Details
- Content [g]
Content [g]
- 500
- Metal content [%]
Metal content [%]
- 88.5
- Grain size
Grain size
- 3 (25-45 µm)
- Melting point
Melting point
- 217 - 219