Solder paste ISO-Cream "Clear"
The solder paste ISO-Cream "Clear" by Felder is a highly flexible SMD solder paste, specifically developed for demanding applications in electronics manufacturing. This paste is characterized by its adaptability, as it can be adjusted to viscosities between 300 and 900 Pa s upon customer request. Quality control is performed using state-of-the-art testing methods according to national and international standards, ensuring 100% batch-to-batch quality.
The paste consists of a lead-free alloy (Sn95.5Ag4Cu0.5) with a eutectic melting point of 217 °C. The metal content is 88.5%, and the particle size used is 25-45 µm (particle size 3), which allows for precise and reliable processing. The solder paste is ideal for high-precision applications where consistent performance and reliable solder joints are required.
Felder, the manufacturer of this product, is known for its innovation and quality in the production of solder pastes and other consumables for the electronics industry.
The paste consists of a lead-free alloy (Sn95.5Ag4Cu0.5) with a eutectic melting point of 217 °C. The metal content is 88.5%, and the particle size used is 25-45 µm (particle size 3), which allows for precise and reliable processing. The solder paste is ideal for high-precision applications where consistent performance and reliable solder joints are required.
Felder, the manufacturer of this product, is known for its innovation and quality in the production of solder pastes and other consumables for the electronics industry.
Details
- Content Content
- 500
- Metal content [%] Metal content [%]
- 88.5
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217 - 219
GHS05
Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)
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