The ISO-Cream® EL3202 solder paste from Felder in the 500g packaging is specifically designed for demanding SMD applications and offers an optimal solution for various soldering processes due to its flexible adaptability to different viscosity requirements (300 to 900 Pa s according to Brookfield, 5 rpm, TF spindle, 25 °C). This solder paste is characterized by a high metal content of 90% and a grain size of category 3 (25-45 µm), which enables precise and reliable application. The eutectic melting point is at 217 °C, which facilitates handling during the soldering process.
The ISO-Cream® EL3202 has been rigorously tested and controlled according to national and international standards, thereby Felder guarantees consistent, batch-to-batch quality. This solder paste is ideal for applications that require high reliability and precision, and effectively supports both lead-free and demanding soldering processes.
Details
- Content
Content
- 500
- Metal content [%]
Metal content [%]
- 90
- Grain size
Grain size
- 3 (25-45 µm)
- Melting point
Melting point
- 217