Solder paste ISO-Cream EL5510 500g
The ISO-Cream® EL5510 500g solder paste from Felder is specifically designed for technical requirements in the field of SMD soldering and offers outstanding flexibility. This solder paste can be customized according to customer requirements with a viscosity ranging from 300 to 900 Pa s, measured using a Brookfield at 5 RPM with a TF spindle at 25 °C. The ISO-Cream® SMD solder pastes are subjected to strict testing and control procedures based on national and international standards to ensure consistent quality across all batches.
The paste is characterized by a high metal content of 88 to 89% and has a particle size in category 3 (25-45 µm), which allows for precise application. The melting point is between 217 °C and 219 °C. The alloy consists of Sn96.5Ag3Cu0.5NiGe and is lead-free, making it an environmentally friendly choice. Ideally suited for demanding SMD applications, this solder paste guarantees reliable and high-quality processing for professional electronics manufacturing.
The paste is characterized by a high metal content of 88 to 89% and has a particle size in category 3 (25-45 µm), which allows for precise application. The melting point is between 217 °C and 219 °C. The alloy consists of Sn96.5Ag3Cu0.5NiGe and is lead-free, making it an environmentally friendly choice. Ideally suited for demanding SMD applications, this solder paste guarantees reliable and high-quality processing for professional electronics manufacturing.
Details
- Content Content
- 500
- Metal content [%] Metal content [%]
- 88 - 89
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217 - 219
GHS05
Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)
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