Solder paste ISO-Cream EWL 250g
The solder paste ISO-Cream EWL 250g from Felder offers outstanding adaptability for specific customer requirements. This SMD solder paste can be individually adjusted with viscosities ranging from 300 to 900 Pa s, measured by Brookfield at 5 RPM with a TF spindle at 25 °C. Compliance with national and international standards ensures consistent quality across all batches.
The paste contains a lead-free alloy Sn95.5Ag4Cu0.5 with a eutectic melting point of 217 °C. The high metal content of 89% and a particle size in the range of 25-45 µm (particle size 3) guarantee excellent printing and flow properties. These characteristics make the ISO-Cream EWL 250g the ideal choice for precise and reliable soldering processes in electronics manufacturing.
The paste contains a lead-free alloy Sn95.5Ag4Cu0.5 with a eutectic melting point of 217 °C. The high metal content of 89% and a particle size in the range of 25-45 µm (particle size 3) guarantee excellent printing and flow properties. These characteristics make the ISO-Cream EWL 250g the ideal choice for precise and reliable soldering processes in electronics manufacturing.
Details
- Content Content
- 250
- Metal content [%] Metal content [%]
- 89
- Grain size Grain size
- 3 (25-45 µm)
- Melting point Melting point
- 217
GHS05
Substances and mixtures that have a corrosive, skin-corrosive and/or severely eye-damaging effect on metals (acids, alkalis)
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